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NE1619 HECETA4 Temperature and voltage monitor
Product data Supersedes data of 2001 Aug 29 2004 May 10
Philips Semiconductors
Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
FEATURES
* Monitor local and remote temperatures * Temperature accuracy of 2 C for local, and 3 C for remote
channel
GENERAL DESCRIPTION
The NE1619 is designed for monitoring the temperatures and supply voltages of microprocessor-based systems by measuring those parameters and comparing the readings with programmable limits. The device provides five possible analog inputs, a remote temperature sensor input and on-board local temperature sensor. The device also monitors its own power supply and provides digital inputs for the Pentium/PRO power supply ID code. The device communicates with the system controller via an SMBus (System Management bus) by which it can be programmed for operation and data collection. Readings come from conversions of the on-board A-to-D converter which cycles through all measurements in sequence in approximately one second when the conversion is started. The device includes a number of registers to store data of the device configuration, status, readings and limits. Except for the temperature-related data which are in 8-bit digital 2's complement format, all the data are in 8-bit digital straight format.
* Temperature resolution of 1 C * 2.8 V to 5.5 V supply range * Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, VCCP, VDD * VIN accuracy of 2% of full scale * Differential non-linearity of 1LSB * No calibration required * Programmable temperature and voltage limits for alarms * Programmable Reset low state pulse output * SMBus 2-wire serial interface * Small 16-lead QSOP package * Compatible with Intel "Heceta 4" specification and reference
designs utilizing it
APPLICATIONS
* System thermal and hardware monitor * Desktop computers * Notebook computers * Industrial controllers * Telecom equipment
ORDERING INFORMATION
Tamb = 0 C to +120 C
Type number Topside mark Package Name NE1619DS NE1619 SSOP16 (QSOP) Description plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm Version SOT519-1
Standard packing quantities and other packaging data are available at www.philipslogic.com/packaging.
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
PINNING Pin Configuration
SDA SCL GND VDD/3.3VSB VID0 VID1 VID2 VID3 1 2 3 4 5 6 7 8 16 A0/RESET/NTEST_OUT 15 VCCPVIN 14 2.5VIN 13 3.3VIN 12 5VIN 11 12VIN/VID4 10 D+ 9 D-/NTEST_IN
SL01228
Pin Description
PIN # 1 2 3 4 5 6 7 8 9 10 11 SYMBOL SDA SCL GND VDD/3.3VSB VID0 VID1 VID2 VID3 D-/NTEST_IN D+ 12VIN/VID4 FUNCTION DESCRIPTION Digital I/O. SMBus serial bi-directional data. Open-drain output. Digital Input. SMBus serial clock input. Ground. To be connected to system ground. Power supply. Can be connected to +3.3 V standby power if monitoring in low power states is required. This pin also serves as the analog input to monitor the VDD voltage level. Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register (LSB bit). Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. Analog/Digital Input. This pin is connected to the negative terminal of the remote temperature sensor for analog input. If this pin is held high at power-up, for digital input, it enables the NAND-TREE test mode. Analog Input. This pin is connected to the positive terminal of the remote temperature sensor. Analog/Digital Input. Defaults at power-up to analog input for monitoring the +12 V supply. This pin is programmable to be a digital input for voltage ID readouts from the processor. Its state is read into the VID4 status register. Analog Input. For monitoring the +5 V supply. Analog Input. For monitoring the +3.3 V supply. Analog Input. For monitoring the +2.5 V supply. Analog Input. For monitoring the processor voltage supply (0 to 3.0 V) Digital I/O. At power-up, the logic input of this pin defines the LSB bit of the device slave address. This pin can be configured to give a low pulse reset output of 20ms minimum. This pin also functions as the output in the NAND-TREE test mode.
12 13 14 15 16
5VIN 3.3VIN 2.5VIN VCCPVIN A0/RESET/NTEST_OUT
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
FUNCTIONAL BLOCK DIAGRAM
Local Temp Sensor D+ D-/ NTEST_IN
Control Logic
Configuration Register
Command Pointer Register Local Temp LL Register
Address Decoder and Register
A0/ RESET/ NTEST_OUT
Temp Mux
Local Temp RDG Register
Local Temp HL Register
Status Register 1
A-to-D Converter GND Voltage Mux VDD
Remote Temp RDG Register
Remote Temp HL Register
Remote Temp LL Register
Status Register 2
VDD Reading Register
VDD HL Register
VDD LL Register
Company # Register
VCCP Reading Register VCCVIN 2.5 VIN 3.3 VIN 5 VIN 3.3 V Reading Register VIN Attenuators 2.5 V Reading Register
VCCP HL Register
VCCP LL Register
Step Version Register
2.5 V HL Register 3.3 V HL Register
2.5 V LL Register
Test Register Reset Pulse Circuit
3.3 V LL Register
12 VIN/ VID4
Switch
5 V Reading Register
5 V HL Register
5 V LL Register
VID 0-3 Register VID3 VID2 VID1 VID0 NTEST Circuit
Vid4 Register
12 V Reading Register
12 V HL Register
12 V LL Register
SMBus Interface
SCL
SDA
SL01229
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
TYPICAL OPERATING CIRCUIT
Remote Sensor 0.1 F 10 k Ground 4 P On-Board PNP Transistor 10 See Note 1 9 or Discrete NPN Transistor 16 Selectable A0/RESET/NTEST_OUT 2 1 CLOCK DATA 10 k VDD
100 k SMBus
System Power Supplies VCCP 2.5 V 3.3 V 5.0 V 12.0 V 11 15 14 13 12
NE1619
Processor Voltage ID Code 5 6 7 8 VID0 VID1 VID2 VID3 VID4
3 Ground
1. May be required in noisy environment, about 1 nF.
SL01230
ABSOLUTE MAXIMUM RATINGS
PARAMETER VDD to GND 12VIN to GND 5VIN, 3.3VIN, 2.5VIN, VCCP to GND Other pins to GND Input current at any pin Package input current Operating temperature range Maximum junction temperature Storage temperature range -65 MIN. -0.3 -0.3 -0.3 -0.3 -5 -20 0 MAX. 6 18 6 VDD+0.3 5 20 +120 +150 +150 UNIT V V V V mA mA C C C
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
Temp Error vs PC Board Track Resistance
20 100 15 10 Remote Temp Error(deg. C) Stdby Supply Current (uA) 5 0 -5 -10 -15 -20 -25 -30 1 10 Leakage Resistance (Mohm) 100 FROM D+ PIN TO VDD FROM D+ PIN TO GND 80
Standby Current vs Supply Voltage
60
40
20
0 0 1 2 3 4 5 6
Supply Voltage (V)
SL01245
SL01243
Figure 1. Temp Error versus PC Board Track Resistance
Figure 3. Standby Current versus Supply Voltage
Temp Error vs D+D- Capacitance
0 -1 -2 Temperature Error (deg. C) Stdby Supply Current (uA) -3 -4 -5 -6 -7 -8 -9 -10 1 2.2 3.3 4.7 6.8 10 22 33 47 40 50
Standby Current vs Temperature
VDD = 5.0V 30 VDD= 3.8V 20 VDD= 3.3V VDD= 2.8V 10
0 -50 -25 0 25 50 75 100 125
D+ to D- Capacitance (nF)
Temperatures (deg. C)
SL01244
SL01242
Figure 2. Temp Error versus D+D- Capacitance
Figure 4. Standby Current versus Temperature
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
Standby Supply Current vs SCLK Frequency
250 10 9 200 Stdby Supply Current (uA) Temperature Error (deg. C) 8 7 6 5 4 3 2 1 0 -1 1K 1K 10K 100K 1000K
Remote Temp Error vs Differential-Mode Noise Frequency
NOISE=10MVP-P SQ.WAVE APPLIED BETWEEN D+ & D- PINS
150
100 VDD=5V 50 VDD=3.3V 0
10K
100K
1000K
10000K
100000K
Noise Frequency (Hz)
SCLK Frequency (Hz)
SL01246
SL01240
Figure 5. Standby Current versus SCLK Frequency Remote Temp Error vs Common-Mode Noise Frequency
30 25 Temperature Error (deg. C) 20 15 10 NOISE=100MVPP 5 0 -5 -10 1K 10K 100K 1000K 10000K 100000K NOISE=50MVPP NOISE IS AC COUPLED TO D- PINS
Figure 7. Temp error versus Different Mode Noise Frequency
Relationship Between Temperature and Temp Reading
125
Temp Reading (Decimal)
100
75
50
25
0 0 25 50 75 100 125 Noise Frequency (Hz) Temperature (deg. C)
SL01241
SL01247
Figure 6. Temp Error versus Common Mode Noise
Figure 8.
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
DC ELECTRICAL CHARACTERISTICS
VDD = 3.3 V, Tamb = 0 C to +120 C unless otherwise specified. SYMBOL VDD IDD IDD tC TR TAI PARAMETER Supply voltage Supply current Supply current Total monitoring cycle time1 Temperature resolution Internal temperature accuracy Standby mode Operating mode All conversions Local and Remote Tamb = 25 C Tamb = 0 C to +120 C Tamb = 25 C Tamb = 0 C to +120 C High level IS Remote source current Low level 10 100 CONDITION MIN. 2.8 TYP. 3.3 100 250 0.25 1.0 2.0 3.0 3.0 5.0 500 0.50 MAX. 5.5 UNIT V A A sec C C C C C A A
TAE
External temperature accuracy
Voltage-to-Digital converter (12VIN, 5VIN, 3.3VIN, 2.5VIN, VCCP, VDD) VUE VDNL VRIN VPSS Unadjusted error Differential non-linearity error VIN input resistance VIN power supply sensitivity 100 1.0 200 1.0 2.0 %FS LSB k %/V
Digital output (SDA, A02) VOH VOL IOH Output High voltage Output Low voltage Output High leakage current IOUT = -3.0 mA, VDD = 2.8 V IOUT = 3.0 mA, VDD = 3.8 V VOUT = VDD 0.4 0.1 10.0 2.4 V V A
SMB digital input voltages (SDA, SCL) VIH VIL Input High voltage Input Low voltage NT_IN3) 2.0 0.4 V V 0.6VDD 0.3VDD V V
Digital input voltages (A0, VID0-4, VIH VIL Input High voltage Input Low voltage
Digital input current (all digital inputs) IIH IIL CIN Input High current Input Low current Input capacitance VIN = VDD VIN = GND 20.0 -1.0 1.0 A A pF
NOTES: 1. Total monitoring cycle time includes all temperature conversions and all voltage conversions. 2. When A0 is selected as output in NAND-TREE test mode. 3. When D- is selected as input in NAND-TREE test mode.
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Product data
HECETA4 Temperature and voltage monitor
NE1619
SMBus INTERFACE AC CHARACTERISTICS
VDD = 3.3 V, Tamb = 0 C to +120 C unless otherwise specified. SYMBOL tSCL tBUF tLOW tHIGH tSU:STA tHD:STA tSU:STO tSU:DAT tHD:DAT tF PARAMETER SCL clock frequency SMBus free time SCL Low time SCL High time Start set-up time Start hold time Stop set-up time Data set-up time Data hold time Fall time 4.7 4.7 4.0 100 100 4.0 250 0 1.0 CONDITION MIN. TYP. MAX. 400 UNIT kHz s s s ns ns s ns ns s
NOTE: 1. These specifications are guaranteed by design and not tested in production.
TIMING DIAGRAM
tHIGH tLOW
SCL tHD:STA tSU:DAT tHD:DAT tSU:STA tSU:STO
SDA tBUF
tF S S P
P
S: Start Condition P: Stop Condition
SL01231
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Product data
HECETA4 Temperature and voltage monitor
NE1619
Table 1. List of registers
NAME CR SR1 SR2 VID VID4 CID SID TEST 2.5VR VCCPR 3.3VR 5VR 12VR VDDR ETR ITR 2.5VHL 2.5VLL VCCPHL VCCPLL 3.3VHL 3.3VLL 5VHL 5VLL 12VHL 12VLL VDDHL VDDLL ETHL ETLL ITHL ITLL COMMAND OR ADDRESS 40h 41h 42h 47h 49h 3Eh 3Fh 15h 20h 21h 22h 23h 24h 25h 26h 27h 2Bh 2Ch 2Dh 2Eh 2Fh 30h 31h 32h 33h 34h 35h 36h 37h 38h 39h 3Ah R/W R/W Read only Read only Read only Read only Read only Read only R/W Read only Read only Read only Read only Read only Read only Read only Read only R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W POR STATE 0000 1000 0000 0000 0000 0000 0000 xxxx 1000 000x 1010 0001 0010 0001 N/A N/A N/A N/A N/A N/A N/A N/A N/A 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 Status register #1 Status register #2 VID register, xxxx = VID3-VID0 VID4 register, x = VID4 Company number Stepping version number Manufacturer test register 2.5VIN reading register VCCPVIN reading register 3.3VIN reading register 5VIN reading register 12VIN reading register VDD reading register External or remote temperature reading register Internal or local temperature reading register 2.5VIN high limit register 2.5VIN low limit register VCCPVIN high limit register VCCPVIN low limit register 3.3VIN high limit register 3.3VIN low limit register 5VIN high limit register 5VIN low limit register 12VIN high limit register 12VIN low limit register VDDVIN high limit register VDDVIN low limit register External or remote temperature high limit register External or remote temperature low limit register Internal or local temperature high limit register Internal or local temperature low limit register DESCRIPTION Configuration register
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
Table 2. Configuration Register (CR, 40h, default = 0000 1000)
BIT 0 NAME START R/W R/W DESCRIPTION Logic 1 enables startup of monitor device, logic 0 places the device in standby mode. Power-up default = 0. At startup, limit checking functions and scanning begins. Note, all High and Low limits should be set into the ASIC prior turning on this bit. 1 2 3 4 5 6 7 Reserved Reserved Reserved RESET 12VIN/VID4 SELECT Reserved Initialization Read Read Read R/W R/W Read R/W Power-up default = 0. Power-up default = 0. Power-up default = 1. Setting this bit generates a minimum 20ms low pulse on the Reset pin, if the reset function is enabled. Power-up default = 0. Selects whether pin 11 acts as a 12 volt analog input monitoring pin, or as a VID[4] input. This pin defaults to the 12 volt analog input. Power-up default = 0. Power-up default = 0. Logic 1 restores power-up default values to the configuration register and the status registers. This bit automatically clears itself. Power-up default = 0.
Table 3. Status Register 1 (SR1, 41h, default = 0000 0000)
BIT 0 1 2 3 4 5 6 7 NAME +2.5V_ERROR VCCP_ERROR +3.3V_ERROR +5V_ERROR Internal Temp Error External Temp Error Reserved Reserved R/W Read Read Read Read Read Read Read Read DESCRIPTION A one indicates 2.5VIN High or Low limit has been exceeded. A one indicates VCCPVIN High or Low limit has been exceeded. A one indicates 3.3VIN High or Low limit has been exceeded. A one indicates 5VIN High or Low limit has been exceeded. A one indicates internal or local temp High or Low limit has been exceeded. A one indicates external or remote temp High or Low limit has been exceeded.
Table 4. Status Register 2 (SR2, 42h, default = 0000 0000)
BIT 0 1 2 3 4 5 6 7 NAME +12V_ERROR VDD_ERROR Reserved Reserved Reserved Reserved Remote Diode Fault Reserved R/W Read Read Read Read Read Read Read Read DESCRIPTION A one indicates 12VIN High or Low limit has been exceeded. A one indicates VDD High or Low limit has been exceeded. Undefined. Undefined. Undefined. Undefined. A one indicates either a short or open circuited fault on the remote thermal diode inputs. Undefined.
Table 5. VID (VID, 47h, default = 0000 VID[3:0] )
BIT 0-3 4-6 7 NAME VID[0:3] Reserved RESET ENABLE R/W Read Read Read DESCRIPTION The VID[0:3] inputs from Pentium/PRO power supplies ID to indicate the operating voltage (e.g. 1.5V to 2.9V). Power-up default = VID[0:3]. Undefined. When set to 1, enables the RESET pin output function. This bit defaults to 0 at Power-up and enables addressing function.
Table 6. VID4 (VID4, 49h, default = 1000 000VID[4] )
BIT 0 1-7 VID4 Reserved NAME R/W Read Read DESCRIPTION VID4 input, if selected, from Pentium/PRO power supplied ID. Power-up default = 0 and pin 11 is not selected for VID4. Power-up default = 1000 000 11
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
FUNCTIONAL DESCRIPTION SMBus serial interface
The NE1619 can be connected to a compatible 2-wire serial interface SMBus as a slave device under the control of a master device or controller, using two device terminals SCL and SDA. The controller will provide a clock signal to the device SCL pin and write/read data to/from the device through the SDA pin. Data of 8-bit digital byte or word are used for communication between the controller and the device. Notice that external pull-up resistors, about 10 k, are needed for the two terminals SCL and SDA.
Because all limit registers are reset to zero, writing limits into the limits registers should usually be the first action to be performed after power-on reset.
Initialization
Initialization or software reset of the NE1619 can be initiated by setting bit 7 of the configuration register. This bit automatically clears itself after being set. The initialization performs a similar reset function to power-on reset, except that the reading and limit registers are not reset.
Starting conversion
The NE1619 monitoring function is started by setting (to 1) the START bit (bit 0) of the configuration register. The device then performs a loop of monitoring about every second. In monitoring function, the device cycles sequentially through all measurements of temperatures and voltages and also performs the comparisons between readings and limits accordingly. The inputs are sampled in this order: Remote diode temperature, Local temperature, VDDVIN, 12VIN, 5VIN. 3.3VIN, 2.5VIN and VCCPVIN. Measured values are stored in reading registers and results of limit comparison are reflected by the state of the flag bits in the status registers. Reading and status data can be read at any time. Limit values should be written into limit registers before starting conversion to avoid false conditions of the status. Resetting (to 0) the START bit (bit 0) of the configuration register will stop the monitoring function and put the device into its standby mode thereby reducing power consumption.
Slave address
The NE1619 slave address on the SMBus is defined by the hardware connection applied to the device pin 16. At power-up this pin is automatically reset to its address sensing function A0. This logic input will set up the value of the LSB bit of the 7-bit address. Because A0 is a two-level digital input and the other 6 bits of the address are predefined to 010110, only two slave addresses can be used as listed below for the device:
Table 7.
A0 connection (Pin 16) GND VDD Slave address 0101100 0101101
Because the logic is sampled and latched into the device storage only at power-up, the device pin 16 can be programmed for different functions while power is on without effecting the address definition.
Temperature measurement
The NE1619 contains an on-chip temperature sensor to measure the local or internal temperature and provides input pins (D- and D+) to measure the remote or external temperature with the use of a remote diode-type sensor. The remote sensor should be connected to the D- and D+ pins properly. The method of temperature measurement is based on the change of the diode VBE at two different operating current levels given by: VBE = (KT/q)*LN(N) where: K: Boltzmann's constant T: absolute temperature in K q: charge on the electron N: ratio of the two currents LN: natural logarithm The NE1619 provides two current sources of about 10 A and 100 A during the measurement of the remote diode VBE and the sensed voltage between two pins D- and D+ is limited within 0.25 V and 0.95 V. The external diode should be selected to meet this current and voltage requirements. The diode-connected PNP transistor provided on the Pentium series microprocessor is typically used, or the discrete diode-connected transistor 2N3904 is recommended. For temperature measurement, local or remote, the VBE is converted into digital data by the on-chip sigma-delta A-to-D converter. The result is stored in the temperature reading register and is also compared with the limits stored in the temperature limit registers in order to set the temperature flag bits in the status register as described in Table 3.
Registers
The NE1619 contains a number of registers, as listed in Table 1, in order to store data of the device setup and operation results. The table indicates the command value and read/write capability of each register for SMBus communication and also the power-up default values for some registers. It includes: - Configuration register to provide control and configuration as well as initialization the NE1619, - Status registers to provide the flags resulting from limit comparisons, - Reading registers to store results of measurements, - Limit registers to store programmable limit data, - ID and test registers. Data are stored in registers by 8-bit digital byte, either in 2's complement format for temperature-related data or in straight format for others. Writing and reading registers will be done on the SMBus by a controller using the SMBus protocols that will be described more in the last section of this functional description. Notice that attempting to write to a "Read only" register will produce an invalid result.
Power-on reset
When the power is applied to the NE1619, also called hardware reset, the registers are reset to their default value, if defined, as shown in Table 1. The content of registers which have indeterminate default value such as reading registers will be unknown. The on-board A-to-D converter is disabled and the monitoring function is not started. The device enters standby mode and draws a supply current less than 100 A.
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Product data
HECETA4 Temperature and voltage monitor
NE1619
Temperature data is represented by a digital 8-bit byte or word in two's complement format with a resolution of 1 C. Theoretically, the temperature value can be from -128 C to +127 C but, practically, the operation range is limited to (0 C, 120 C). Here are some of temperature values and data:
necessary. No external resistor-divider should be used for the VIN pins because of the effect of the internal input resistors, about 140 k at each pin, on the divider accuracy.
Processor Voltage ID (VID)
The NE1619 provides 5 digital pins (VID0-VID4) to read the processor voltage ID code and store it into the VID registers so that the code can be read over the SMBus:
Table 8.
TEMPERATURE VALUE (C) +127 +126 +100 +25 +1 0 -1 -25 -50 TEMPERATURE DATA 0111 1111 0111 1110 0110 0100 0001 1001 0000 0001 0000 0000 1111 1111 1110 0111 1100 1110
VID register: VID4 register:
bit 0-bit3 bit 0
reflect VID0-VID3 respectively reflects VID4
Because the VID4 function of 12VIN/VID4 pin (Pin 11) is not selected at power-up (default function of this pin is 12VIN), the process of selecting this pin must be performed, if VID4 is needed, by setting (to 1) bit 5 (12VIN/VID4 SELECT) of the configuration register. The default value of bit 0 of the VID4 register is 0. The VID inputs should not be left floating because they are not internally biased. If they are not used then they should be connected to either GND or VDD with resistors.
Limit data
High and Low limits for temperatures and voltages should be programmed into the limit registers using the format as described above. During monitoring cycle, the measured data is automatically compared with the limits and flag bits in the status registers are set accordingly to the results. The assignment of the status bits are listed in Tables 3 and 4.
Voltage measurement
The NE1619 provides 5 analog inputs for directly monitoring the power supplies typically found in a PC, having nominal values of +2.5 V, +3.3 V, +5.0 V, +12.0 V and VCCP (2.25 V). The device also monitors its own VDD which nominal value is 3.3 V. Notice that, at power-up, the device Pin 11 is defaulted to its 12VIN function. These inputs are internally attenuated by on-chip resistor networks to the reference levels that are then multiplexed to a 8-bit Delta-Sigma A-to-D converter for converting into digital data. Each VIN input is overall scaled in such a way that the decimal value of the data for its nominal voltage value is equal to 192. It means that the overall step size of the conversion for each VIN is equal to 1/192 of its nominal value. Reading data are stored in the VIN reading registers and are also compared with the limits stored in the VIN limit registers in order to set the voltage flag bits in the status registers as described in Tables 3 and 4. The VIN data, different with the temperature data, is represented by a digital 8-bit byte or word in straight format with a resolution LSB equal to 1/192 of the nominal value, and has any value from 0 to 255. This is how to calculate the VIN error from the VIN reading at any input including VDD: Resolution in volts: LSB = (VIN nominal in volt)/192 Full scale in volts: FS= 255 * LSB Reading value in volts: VIN value = (decimal value of VIN reading) * LSB Reading error in volts: VIN error = (VIN value) - (VIN applied) VIN error in % of FS: VIN error % = 100*(VIN error)/FS Applied value < 0 results in a reading of about 0 Applied value > FS results in a reading of about 255
Status registers
Results of limits comparisons are reflected by status or flag bits stored in the status register 1 and 2. If the reading is within the limits then the corresponding flag bit will be cleared to 0. Otherwise, it will be set to 1. Status data can be read over the SMBus. Notice that because the flag bits are automatically updated at every monitoring cycle, their states only reflect the last measurements.
Diode fault status
The hardware connection at the diode pins (D+ and D-) are also checked at the measurement of external temperature and the fault condition is indicated by the flag bit 6 of the status register 2. This bit is set to 1 if either short or open circuit fault is detected.
RESET output function
The NE1619 Pin 16 can be selected as a reset pulse output. When this function is selected and the reset pulse is initiated, this pin will output a single (minimum 20 ms) low state pulse. The reset output function is selected by setting (to 1) the RESET ENABLE bit (bit 7) of the VID register. Thereafter, the reset pulse is generated whenever the RESET bit (bit 4) of the configuration register is programmed to change from 0 to 1. Because Pin 16 becomes an open-drain output when it is selected as an output, an external pull-up resistor, about 100 k is needed for the output operation. This will restrict the address function on Pin 16 to being high at power-up. Therefore, if multiple NE1619's are connected on the same bus, only one can have this function enabled at one time.
Input safety
Since the power supply voltages will appear directly at VIN pins, a small external resistor, about 500 , should be connected in series with each pin in order to prevent damaging the power supplies due to accidental short. These resistors are recommended but not
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Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
NAND-tree test
A NAND tree is provided in the NE1619 for Automated Test Equipment (ATE) board level connectivity testing. The device is placed into NAND tree test mode by powering up with Pin 9 (D-/NTEST_IN) held high. In this test mode Pin 16 (A0/RESET/NTEST_OUT) becomes the NAND-tree output and all input pins become NAND-tree inputs as illustrated in Figure 1.
To perform a NAND tree test all pins should be initially driven low. Then one-by-one toggle them high (and keep them high), starting with the input closest to the output, cycling toward the farthest, the NAND tree output will toggle with each input change.
SDA SCL VID0 VID1 VID2 VID3 VID4 NTEST_OUT
SL01232
Figure 1. NAND-tree circuitry
Table 9. NAND-tree test vectors
VECTOR # 1 2 3 4 5 6 7 8 SDA L L L L L L L H SCL L L L L L L H H VID0 L L L L L H H H VID1 L L L L H H H H VID2 L L L H H H H H VID3 L L H H H H H H VID4 L H H H H H H H NTEST_OUT H L H L H L H L
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Product data
HECETA4 Temperature and voltage monitor
NE1619
SMBus interface protocol
The NE1619 can communicate over a compatible 2-wire serial interface SMBus using the two device pins SCL and SDA. The device employs three standard SMBus protocols: Write Byte, Read Byte and Receive byte. Data formats of those protocols are shown below with following notices: condition (S) and terminates data transfer by generating a stop condition (P).
* The 7-bit slave address is replaced by the selected address of the
device.
* The command byte is replaced by the selected command of the
device register.
* The SMBus controller initiates data transfer by establishing a start * Data is sent over the serial bus in sequence of 9 clock pulses for
each 8-bit data byte followed by 1-bit status of the device acknowledgement (A).
* The receive byte format is used for quickly transfer data from a
reading register which was previously selected by a read.
* During the transition between start and stop conditions, data must
be stable and valid when the SCL is high.
Write Byte Format:
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 (TO NEXT) 0 S DEVICE ADDRESS 1 0 1 1 0 a0 W A DEVICE REGISTER COMMAND D7 D6 D5 D4 D3 D2 D1 D0 A (TO NEXT)
SCL SDA
1
2
3
4
5
6
7
8
9
SCL (continued) SDA (continued)
D7 D6 D5 D4 D3 D2 D1 D0 A DATA TO BE WRITTEN TO REGISTER P
Read Byte Format:
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 (TO NEXT) 0 S DEVICE ADDRESS 1 0 1 1 0 a0 W A DATA REGISTER COMMAND D7 D6 D5 D4 D3 D2 D1 D0 A P STOP (TO NEXT)
SCL SDA
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL (continued) SDA (continued)
S RESTART DEVICE ADDRESS 0 1 0 1 1 0 a0 R A DATA FROM DEVICE REGISTER D7 D6 D5 D4 D3 D2 D1 D0 NA P STOP
Receive Byte Format:
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
SCL SDA
S DEVICE ADDRESS 0 1 0 1 1 0 a0 R A DATA FROM DEVICE REGISTER D7 D6 D5 D4 D3 D2 D1 D0 NA P
(end) Figure 2. NE1619 SMBus interface protocols
SL01233
2004 May 10
15
Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
Printed Circuit Board layout considerations
Care must be taken in PCB layout to minimize noise induced at the remote temperature sensor inputs, especially in extremely noisy environments, such as a computer motherboard. Noise induced in the traces running between the device sensor inputs and the remote diode can cause temperature conversion errors. Typical sensor signal levels to the NE1619 is a few microvolts. The following guidelines are recommended: 1. Place the NE1619 as close as possible to the remote sensor. It can be from 4 to 8 inches, as long as the worst noise sources such as clock generator, data and address buses, CRTs are avoided. 2. Route the D+ and D- lines parallel and close together with ground guards enclosing them (see `Ideal diode trace layout', Figure 3). 3. Leakage currents due to PC board contamination must be considered. Error can be introduced by these leakage currents. 4. Use wide traces to reduce inductance and noise pickup. Narrow traces more readily pickup noise. The minimum width of 10 mil and space of 10 mil are recommended. 5. Place a bypass capacitor of 10 nF close to the VDD pin and an input filter capacitor of 2200 pF close to the D+ and D- pins.
6. A shielded twisted pair is recommended for a long distance remote sensor. Connect the shield of the cable at the device side to the NE1619 GND pin and leave the shield at the remote end unconnected to avoid ground loop currents. Also notice that the series resistance of the cable may introduce measurement error; 1 can introduce about 0.5 C.
GND
D+
D-
GND
SL02017
Figure 3. Ideal diode trace layout.
2004 May 10
16
Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
2004 May 10
17
Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
REVISION HISTORY
Rev _3 Date 20040510 Description Product data (9397 750 13254). Supersedes data of 2001 Aug 29.
* Add I2C-bus logos. * Features section, 12th bullet: change package name from "SSOP" to "QSOP". * Ordering information table:
- add Temperature Range, Topside mark, and package name (QSOP). - add note following table.
Modifications:
* Pin Description table: correct Pin 16 Symbol from "A0/RESET/NTEST_IN" to "A0/RESET/NTEST_OUT". * Add "Printed Circuit Board layout considerations" section.
_2 _1 20010829 20000713 Product data (9397 750 08874). Supersedes data of 2000 Jul 13. Product specification (9397 750 07323).
2004 May 10
18
Philips Semiconductors
Product data
HECETA4 Temperature and voltage monitor
NE1619
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specifications defined by Philips. This specification can be ordered using the code 9398 393 40011.
Data sheet status
Level
I
Data sheet status [1]
Objective data
Product status [2] [3]
Development
Definitions
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data
Qualification
III
Product data
Production
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products--including circuits, standard cells, and/or software--described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
(c) Koninklijke Philips Electronics N.V. 2004 All rights reserved. Printed in U.S.A. Date of release: 05-04
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Document order number:
9397 750 13254
Philips Semiconductors
2004 May 10 19

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